Sub-Terahertz High-Power Amplifiers

In this seminar, I will try to cover only a few topics but explain each topic well to a broad audience. First, I will introduce the electromagnetic spectrum by asking questions such as "How wide is the electromagnetic spectrum?" "Who owns it?" and "How much is it worth?" Next, I will introduce the electrical permittivity as one of important material characteristics, and how we measure the extraordinary permittivity of ultra-low-loss 4H SiC at sub-THz frequencies for the first time. Third, I will introduce atmospheric attenuation at sub-THz frequencies as a window of opportunity for our novel devices based on a substrate-integrated waveguide. Finally, I will conclude by suggesting that our state-of-the-art materials and devices can enable a single-chip sub-THz transceiver through 3D integration of chiplets of different semiconductor technologies on an interposer.

Bio:
James C. M. Hwang received the B.S. degree in physics from National Taiwan University, Taipei, Taiwan, and the M.S. and Ph.D. degrees in materials science and engineering from Cornell University, Ithaca, NY, USA. He is currently the first Research Professor in the College of Engineering, Cornell University, Ithaca, NY, USA. Prior to that, he spent most of his academic career with Lehigh University, Bethlehem, PA, USA, after years of industrial experience at IBM, Yorktown Heights, NY, USA, Bell Labs, Murray Hill, NJ, USA, GE, Syracuse, NY, USA, and GAIN, Somerville, NJ, USA. He cofounded GAIN and QED, Bethlehem, PA, USA; the latter became the public company IQE and remains the world's largest compound-semiconductor epitaxial wafer supplier. He was a Consultant for the U.S. Air Force Research Laboratory, Dayton, OH, USA, and a Program Officer for GHz-THz Electronics with the Air Force Office of Scientific Research, Arlington, VA, USA. He was an IEEE Distinguished Microwave Lecturer. He is an IEEE Life Fellow and an Editor of IEEE Transactions on Microwave Theory and Techniques. He has worked for decades on electronic, optoelectronic, and micro-electromechanical materials and devices. He was the recipient of many honors and awards, including the IEEE Lester F. Eastman Award for outstanding achievement in high-performance semiconductor devices. His current research focuses on sub-terahertz materials and devices for next-generator automobile radars, Internet of Space, and 6G wireless communications